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Tungsten-copper components

Tungsten-copper products primarily consist of tungsten and copper, with a copper content of 20±1%, a density ≥15.40 g/cm³, and a uniform appearance free of defects such as pores or cracks. They exhibit an airtightness of ≤1×10⁻⁹ Pa·m³/s, thermal conductivity of 206 W/m·K, and a thermal expansion coefficient of 7.7 ppm/℃, offering excellent overall performance and compatibility with chip materials. Utilizing injection molding technology, complex shapes can be directly produced, significantly reducing machining requirements, conserving raw materials, and lowering production costs. Suitable for thermal management needs across multiple fields including optical modules, aerospace, and military applications, market demand is robust. Complex-shaped products yield higher profit margins, and core technologies are protected by proprietary intellectual property rights.
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Product Specifications:

NameTungsten-copper components
Copper content(%)20±1
Density(g/cm³)≥15.40
Thermal conductivity(W/m*k)206


Preparation process: Injection molding.

Packing method: carton + pearl cotton (can be packed according to customer requirements)

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Application Fields:

  • Telecommunications: Used in 5G/6G network base stations, telecommunications transmission, and similar scenarios.
  • Data Centers: Serves AI computing clusters, network storage, and other scenarios requiring large-scale data processing.
  • Industrial Control & Defense: Intelligent driving, quantum communication, medical imaging, military communication systems, etc.
  • High-End Molds: Manufacturing of high-hardness material molds.
  • Aerospace: Aerospace tail nozzles, weapon projectile shrouds, etc.
  • Medium-High Voltage Electrical Contacts: High-voltage resistant electrical contacts (switches).
  • Other Fields: Wear-resistant and corrosion-resistant components, sports equipment like golf club heads.

   

Hot Tags : 钨铜制件
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