Product Specifications：
| Name | Tungsten-copper components |
| Copper content（%） | 20±1 |
| Density（g/cm³） | ≥15.40 |
| Thermal conductivity（W/m*k） | 206 |
Preparation process: Injection molding.
Packing method: carton + pearl cotton (can be packed according to customer requirements)
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Application Fields:
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