Tungsten-copper products primarily consist of tungsten and copper, with a copper content of 20±1%, a density ≥15.40 g/cm³, and a uniform appearance free of defects such as pores or cracks. They exhibit an airtightness of ≤1×10⁻⁹ Pa·m³/s, thermal conductivity of 206 W/m·K, and a thermal expansion coefficient of 7.7 ppm/℃, offering excellent overall performance and compatibility with chip materials.
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